? semiconductor components industries, llc, 2001 september, 2001 rev. 8 1 publication order number: mc10H116/d mc10H116 triple line receiver the mc10H116 is a functional/pinout duplication of the mc10116, with 100% improvement in propagation delay and no increase in powersupply current. ? propagation delay, 1.0 ns typical ? power dissipation 85 mw typ/pkg (same as mecl 10k) ? improved noise margin 150 mv (over operating voltage and temperature range) ? voltage compensated ? mecl 10kcompatible figure 1. logic diagram *v bb to be used to supply bias to the mc10h115 only and bypassed (when used) with 0.01 m f to 0.1 m f capacitor to ground (0 v). v bb can source < 1.0 ma. the mc10h115 is designed to be used in sensing differential signals over long lines. the bias supply (v bb ) is made available to make the device useful as a schmitt trigger, or in other applications where a stable reference voltage is necessary. active current sources provide these receivers with excellent commonmode noise rejection. if any amplifier in a package is not used, one input of that amplifier must be connected to v bb to prevent unbalancing the currentsource bias network. the mc10h115 does not have internalinput pull down resistors. this provides high impedance to the amplifier input and facilitates differential connections. applications: ? low level receiver ? voltage level ? schmitt trigger interface figure 2. dip pin assignment v cc1 a out a out a in a in b out b out v ee v cc2 c out c out c in c in v bb b in b in 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 5 4 11 3 2 10 9 7 6 13 12 15 14 when input pin with bubble goes positive it's respective output pin with bubble goes positive. v cc1 = pin 1 v cc2 = pin 16 v ee = pin 8 v bb * pin assignment is for dualinline package. for plcc pin assignment, see the pin conversion tables on page 18 of the on semiconductor mecl data book (dl122/d). device package shipping ordering information mc10H116l cdip16 25 units/rail mc10H116p pdip16 25 units/rail mc10H116fn plcc20 48 units/rail marking diagrams 1 16 a = assembly location wl = wafer lot yy = year ww = work week cdip16 l suffix case 620a mc10H116l awlyyww pdip16 p suffix case 648 plcc20 fn suffix case 775 10H116 awlyyww 1 1 16 mc10H116p awlyyww so16 d suffix case 751b 1 16 1 16 10H116 awlyww 1 16 1 16 1 http://onsemi.com mc10H116d so16 55 units/rail www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 2 maximum ratings symbol characteristic rating unit v ee power supply (v cc = 0) 8.0 to 0 vdc v i input voltage (v cc = 0) 0 to v ee vdc i out output current continuous surge 50 100 ma t a operating temperature range 0 to +75 c t stg storage temperature range plastic ceramic 55 to +150 55 to +165 c c electrical characteristics (v ee = 5.2 v 5%) (note 2) 0 25 75 symbol characteristic min max min max min max unit i e power supply current 23 21 23 ma i inh input current high 150 95 95 m a i cbo input leakage current 1.5 1.0 1.0 m a v bb reference voltage 1.38 1.27 1.35 1.25 1.31 1.19 vdc v oh high output voltage 1.02 0.84 0.98 0.81 0.92 0.735 vdc v ol low output voltage 1.95 1.63 1.95 1.63 1.95 1.60 vdc v ih high input voltage (note 1) 1.17 0.84 1.13 0.81 1.07 0.735 vdc v il low input voltage (note 1) 1.95 1.48 1.95 1.48 1.95 1.45 vdc v cmr common mode range (note 4) 2.85 to 0.8 vdc v pp input sensitivity (note 3) 150 typ mv pp ac parameters t pd propagation delay 0.4 1.3 0.4 1.3 0.45 1.45 ns t r rise time 0.5 1.5 0.5 1.6 0.5 1.7 ns t f fall time 0.5 1.5 0.5 1.6 0.5 1.7 ns 1. when v bb is used as the reference voltage. 2. each mecl 10h series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. the circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lin ear fpm is maintained. outputs are terminated through a 50ohm resistor to 2.0 volts. 3. differential input not to exceed 1.0 vdc. 4. 150 mv pp differential input required to obtain full logic swing on output. www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 3 package dimensions plcc20 fn suffix plastic plcc package case 77502 issue d notes: 1. datums -l-, -m-, and -n- determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum -t-, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 --- 0.51 --- k 0.025 --- 0.64 --- r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y --- 0.020 --- 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 --- 1.02 --- m n l y brk w v d d s l-m m 0.007 (0.180) n s t s l-m m 0.007 (0.180) n s t s l-m s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s l-m m 0.007 (0.180) n s t s l-m m 0.007 (0.180) n s t s l-m s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s l-m m 0.007 (0.180) n s t s l-m m 0.007 (0.180) n s t h view s k k1 f g1 www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 4 package dimensions cdip16 l suffix ceramic dip package case 620a01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension f may narrow to 0.76 (0.030) where the lead enters the ceramic body. 5 this drawing replaces obsolete case outline 620-10. f e n k c seating plane a m 0.25 (0.010) t m l dim min max min max millimeters inches a 0.750 0.785 19.05 19.93 b 0.240 0.295 6.10 7.49 c --- 0.200 --- 5.08 d 0.015 0.020 0.39 0.50 e 0.050 bsc 1.27 bsc f 0.055 0.065 1.40 1.65 g 0.100 bsc 2.54 bsc h 0.008 0.015 0.21 0.38 k 0.125 0.170 3.18 4.31 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 a b a b 16 1 9 8 g 16x d b m 0.25 (0.010) t t 16x j www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 5 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 pdip16 p suffix plastic dip package case 64808 issue r www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 6 package dimensions so16 d suffix plastic dip package case 751b05 issue j notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p b a m 0.25 (0.010) b s t d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 7 notes www.datasheet.co.kr datasheet pdf - http://www..net/
mc10H116 http://onsemi.com 8 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mc10H116/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com n. american technical support : 8002829855 toll free usa/canada www.datasheet.co.kr datasheet pdf - http://www..net/
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